Finite element method for predicting equilibrium shapes of solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 115, Issue 2, 1993, Pages 141-146

  Nigro, N J ^a   Heinrich, S M ^a   Elkouh, A F ^a   Zou, X ^a   Fournelle, R ^a   Lee, Ping S ^b  

^a MARQUETTE UNIVERSITY   (United States)

^b Allen Bradley Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT MANUFACTURE; SPATIAL VARIABLES MEASUREMENT; STRENGTH OF MATERIALS; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMOANALYSIS;

EQUILIBRIUM SHAPES; SURFACE MOUNT REFLOW PROCESS;

SOLDERED JOINTS;

EID: 0027611025     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2909309     Document Type: Article

References (21)

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