Metallic Microstructures Fabricated Using Photosensitive Polyimide Electroplating Molds

Journal of Microelectromechanical Systems

Volumn 2, Issue 2, 1993, Pages 87-94

  Frazier, A Bruno ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTROPLATING; FABRICATION; LIGHT SENSITIVE MATERIALS; LITHOGRAPHY; METALLIC SUPERLATTICES; MICROMACHINING; MICROSTRUCTURE; MOLDING; MORPHOLOGY; POLYIMIDES; SEMICONDUCTOR DEVICE STRUCTURES;

SHARP SIDEWALL MICROSTRUCTURES; SURFACE MICROMACHINING SACRIFICIAL LAYER TECHNIQUES; VERTICALLY INTEGRATED STRUCTURES;

MICROELECTROMECHANICAL DEVICES;

EID: 0027607944     PISSN: 10577157     EISSN: 19410158     Source Type: Journal    
DOI: 10.1109/84.232605     Document Type: Article

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