Mechanical Design Considerations for Area Array Solder Joints

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 3, 1993, Pages 272-283

  Børgesen, Peter ^a   Li, Che Yu ^a   Conway, H D ^a  

^a Department of Materials Science and Engineering Cornell University ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING; SURFACE MOUNT TECHNOLOGY;

CONCURRENT ENGINEERING; JOINT STIFFNESS; LOCAL STRESS;

ELECTRONICS PACKAGING;

EID: 0027596772     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.232053     Document Type: Article

References (14)

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2. N. G. Koopman, T. C. Reilly, and P. A. Totta, “Chip-to-package Interconnections,” in Microelectronics Packaging Handbook, R. R. Tummala and E. J. Rymaszewski, eds. New York: Van Nostrand Reinhold, 1989, pp. 361–453.
3. L. S. Goldman, “Geometric optimization of controlled collapse interconnections,” IBM J. Res. Develop, vol. 5, pp. 251–265, 1969.
4. P. Børgesen, C.-Y. Li, and H.D. Conway, “Analytical estimates of thermally induced stresses and strains in flip-chip solder joints,” in Proc. ASME/JSME Joint Conf. on Electronic Packaging, 1992, pp. 845–854.
5. H. D. Conway, P. Børgesen, and C.-Y. Li, “Elastic analysis of flip-chip solder joints undergoing thermal excursions,” to be published.
6. R. Subrahmanyan, J. R. Wilcox, and C.-Y. Li, “A damage integral approach to solder joint fatigue,” in Proc. 2nd ASM Int. Electronics Materials and Processing Congress, Metals Park, 1989, pp. 213–221.
7. B. Yost, J. McGroarty, P. Børgesen, and C.-Y. Li, “The shape of a liquid drop constrained by parallel plates,” pp. xxx-xxx, this issue.
8. J. McGroarty, P. Børgesen, B. Yost, and C.-Y. Li, “Statistics of solder joint alignment for optoelectronic components,” to be published.
9. S. Timoshenko and J.N. Goodier, Theory of Elasticity. New York: McGraw-Hill, 1951.
10. I.A. Blech and A.A. Levi, “Comments on Aleck’s stress distribution in clamped plates,” Trans. ASME, vol. 48, pp. 442–445, 1981.
11. Y. Tsukada, Y. Mashimoto, T. Nishio, and N. Mii, “Reliability and stress analysis of encapsulated flip chip joint on epoxy based printed circuit board,” in Proc. ASME/JSME Joint Conf. on Electronic Packaging, 1992, pp. 827–835.
12. P. Børgesen, H.D. Conway, and C.-Y. Li, to be published.
13. J. R. Wilcox, “Inelastic deformation and fatigue damage in petals at high homologous temperatures,” Ph.D. dissertation, Cornell University, 1990.
14. P. Børgesen, J.G. Maggard, D.D. Brown, S. Bolton, and C.-Y. Li, “Effects on composition of fatigue crack growth in Pb/Sn solder,” to be published.