Effect of interfacial layers on the mechanical properties of Ag-clad Bi-based superconducting composite tapes

Superconductor Science and Technology

Volumn 6, Issue 3, 1993, Pages 195-198

  Dou, S X ^a   Guo, Y C ^a   Yau, J ^a   Liu, H K ^a  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

BEND TEST; CRITICAL CURRENT DENSITY; FLEXIBILITY; INTERFACIAL LAYERS; SUPERCONDUCTING COMPOSITE TAPES;

BISMUTH COMPOUNDS; COMPOSITE MATERIALS; COPPER OXIDES; CRACKS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER; STRAIN; STRENGTH OF MATERIALS; TAPES; TENSILE TESTING;

SUPERCONDUCTING MATERIALS;

EID: 0027565457     PISSN: 09532048     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-2048/6/3/006     Document Type: Article

References (9)

1. Microstructures andJc-BCharacteristics of Ag-Sheathed Bi-Based Superconducting Wires