The effect of area ratio on the flow distribution in liquid cooling module manifolds for electronic packaging

International Communications in Heat and Mass Transfer

Volumn 20, Issue 2, 1993, Pages 221-234

  Choi, Steve H ^a   Shin, Sehyun ^a   Cho, Young I ^a  

^a DREXEL UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLANTS; ELECTRONIC SYSTEMS; MANIFOLDS;

CHANNEL FLOW; COOLANTS; COOLING SYSTEMS; ELECTRONICS PACKAGING; GEOMETRY; HEAT EXCHANGERS; HEAT TRANSFER; LIQUIDS; MATHEMATICAL MODELS; NUMERICAL ANALYSIS;

AREA RATIOS; COOLANT FLOW DISTRIBUTION; LIQUID COOLING MODULES; PARALLEL FLOW MANIFOLDS; REYNOLDS NUMBER;

FLOW OF FLUIDS;

EID: 0027561628     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/0735-1933(93)90050-6     Document Type: Article

References (12)

1. On the Characteristics of Divided Flow and Confluent Flow in Headers
2. The Effect of Friction on Flow Distribution in Dividing and Combining Flow Manifolds
3. An improved Mathematical Formulation for the Computations of Flow Distributions in Manifolds for Compact Heat Exchangers
4. Inlet and Exit-Header Shapes for Uniform Flow Through a Resistance Parallel to the Main Stream