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Volumn 3, Issue 1, 1993, Pages 2373-2376

Planarization Techniques for Multilevel Hts Integrated Circuit Process

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COPPER OXIDES; EPITAXIAL GROWTH; ETCHING; INTEGRATED CIRCUIT MANUFACTURE; YTTRIUM COMPOUNDS;

EID: 0027557930     PISSN: 10518223     EISSN: 15582515     Source Type: Journal    
DOI: 10.1109/77.233424     Document Type: Letter
Times cited : (3)

References (8)
  • 1
    • 0010318346 scopus 로고
    • High Tc thin films and electronic devices
    • June
    • R., Simon, High Tc thin films and electronic devices, Physics Today, 44, 64, 70, June 1991
    • (1991) Physics Today , vol.44 , pp. 64-70
    • Simon, R.1
  • 2
    • 36549090789 scopus 로고
    • Novel method of patterning YBaCuO superconducting thin films
    • Aug
    • E.S., Ma, Novel method of patterning YBaCuO superconducting thin films, Appl. Phys. Lett, 55, 896, 898, Aug 1989
    • (1989) Appl. Phys. Lett , vol.55 , pp. 896-898
    • Ma, E.S.1
  • 4
    • 84949084737 scopus 로고
    • SiO2 planarization by two-step rf bias-sputtering,” sputtering,” J. Vac. Sci. Technol
    • May/June
    • T., Mogami, M., Morimoto, H., Okabayashi, E., Nagasawa, SiO2 planarization by two-step rf bias-sputtering,” sputtering,” J. Vac. Sci. Technol, 3, 856, 861, May/June 1985
    • (1985) , vol.3 , pp. 856-861
    • Mogami, T.1    Morimoto, M.2    Okabayashi, H.3    Nagasawa, E.4
  • 5
    • 0026170357 scopus 로고
    • Patrick, W.L. Guthrie, C.L. Standley, and P.M. Schiable, “Application of chemical mechanical polishing to the fabrication of VLSI interconnections, “J. Electrochem
    • June
    • Patrick, W.L. Guthrie, C.L. Standley, and P.M. Schiable, “Application of chemical mechanical polishing to the fabrication of VLSI interconnections, “J. Electrochem, 138, 1778, 1784, June 1991
    • (1991) , vol.138 , pp. 1778-1784
  • 7
    • 0016993284 scopus 로고
    • Somekh, “Introduction to ion and plasma etching, “J. Vac. Sci
    • Sept./Oct
    • Somekh, “Introduction to ion and plasma etching, “J. Vac. Sci, Technol, 13, 1003, 1007, Sept./Oct 1976
    • (1976) Technol , vol.13 , pp. 1003-1007
  • 8
    • 36449003194 scopus 로고
    • Wet etch process for patterning insulators suitable for epitaxial high Tc superconducting thin film multilevel electronic circuits
    • Sept
    • W., Eidelloth, W.J., Gallagher, R.P., Robertazzi, R.H., Koch, B., Oh, Wet etch process for patterning insulators suitable for epitaxial high Tc superconducting thin film multilevel electronic circuits, Appl. Phys. Lett, 59, 1257, 1259, Sept 1991
    • (1991) Appl. Phys. Lett , vol.59 , pp. 1257-1259
    • Eidelloth, W.1    Gallagher, W.J.2    Robertazzi, R.P.3    Koch, R.H.4    Oh, B.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.