|
|
Volumn 37, Issue 2, 1993, Pages 117-123
|
|
Electroless plating of copper at a low pH level
a
a
NONE
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
AGENTS;
AMINES;
COMPOSITION EFFECTS;
ELECTROLESS PLATING;
ELECTRONICS PACKAGING;
PH EFFECTS;
PROCESS CONTROL;
REDUCTION;
AMINE BORANE REDUCING AGENTS;
ELECTROLESS BATH PERFORMANCE;
LIGANDS;
NEUTRAL TETRADENTATE NITROGEN DONORS;
COPPER PLATING;
|
|
EID: 0027555435
PISSN: 00188646
EISSN: None
Source Type: Journal
DOI: 10.1147/rd.372.0117 Document Type: Article |
|
Times cited : (45)
|
|
References (26)
|
