Analysis of the reaction between 60Sn-40Pb solder with a Pd-Pt-Ag-Cu-Au alloy

Journal of Electronic Materials

Volumn 22, Issue 2, 1993, Pages 185-194

  Frear, D R ^a   Michael, J R ^a   Hlava, P F ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Intermetallic formation; Paliney 7 ; Pb Sn solder; wettability

Indexed keywords

ALLOYS; COPPER ALLOYS; GLASS; GOLD ALLOYS; INTERMETALLICS; METALS; PALLADIUM ALLOYS; SEALS; SEMICONDUCTOR DEVICE MANUFACTURE; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

PALLADIUM PLATINUM SILVER COPPER GOLD ALLOYS; SOLDERS; TIN LEAD ALLOYS;

SOLDERED JOINTS;

EID: 0027545541     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02665025     Document Type: Article

References (20)