Diffusion of copper into gold plating

Conference Record - IEEE Instrumentation and Measurement Technology Conference

Volumn , Issue , 1993, Pages 114-117

  Pucic, Sunchana P ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; ELECTROPLATING SOLUTIONS; INTERFACES (MATERIALS); MICROWAVE DEVICES;

COLD FILM; COPPER LAYER; CUPROUS OXIDE; DIFFUSION BARRIER;

GOLD PLATING;

EID: 0027239085     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)