Thermal and mechanical analysis of flip-chips on a liquid-cooled multichip module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1993, Pages 22-31

  Narayanan, Ramanathan ^a   Hall, Peter M Dr ^a   Chanchani, Rajen Dr ^a  

^a UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; THERMAL STRESS; THERMOANALYSIS;

COFFIN-MANSON ANALYSIS; CONVECTION COEFFICIENTS; FLIP-CHIPS; MULTI-CHIP MODULES;

INTEGRATED CIRCUITS;

EID: 0027238011     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)