Control of isotropic and anisotropic etching and surface cleaning of silicon and silicon dioxide in a hydrogen plasma

Materials Research Society Symposium Proceedings

Volumn 282, Issue , 1993, Pages 511-516

  Veprek, S ^a   Wang, Ch ^a   Ratz, G ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ETCHING; HYDROGEN; IMPURITIES; MORPHOLOGY; PLASMA APPLICATIONS; SILICA; SURFACE CLEANING; SURFACE PROPERTIES; THERMAL EFFECTS;

ION BOMBARDMENT; SELECTIVE OXYGEN REMOVAL;

SEMICONDUCTING SILICON;

EID: 0027211155     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)