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Volumn 48, Issue 1-4, 1993, Pages 263-272

Microstructure-related fracture toughness and fatigue crack growth behaviour in toughened, anhydride-cured epoxy resins

a INSTITUT FÜR VERBUNDWERKSTOFFE GMBH (Germany)

Author keywords

cross link density; CTBN modifier; epoxy resin; fatigue crack propagation; fractography; fracture toughness; silicon rubber; toughening

Indexed keywords

ABS RESINS; CRACK PROPAGATION; CROSSLINKING; CURING; FATIGUE OF MATERIALS; FRACTURE; LOADS (FORCES); MEASUREMENTS; MICROSTRUCTURE; MORPHOLOGY; SILICONES; TOUGHENING;

ANHYDRIDE CURED EPOXY RESINS; CARBOXYL TERMINATED ACRYLONITRILE BUTADIENE (CTBN); CROSSLINK DENSITY; DYNAMIC MECHANICAL ANALYSIS;

EPOXY RESINS;

EID: 0027188472 PISSN: 02663538 EISSN: None Source Type: Journal
DOI: 10.1016/0266-3538(93)90143-5 Document Type: Article

Times cited : (69)

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