3D characterization of air bridges and via holes in conductor-backed coplanar waveguides for MMIC applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1993, Pages 709-712

  Visan, S ^a   Picon, O ^a   Fouad Hanna, V ^a  

^a Telecommunications France Telecom   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BRIDGE CIRCUITS; CHARACTERIZATION; ELECTRIC LINES; FINITE DIFFERENCE METHOD; MICROSTRIP DEVICES; MONOLITHIC INTEGRATED CIRCUITS; THREE DIMENSIONAL; TIME DOMAIN ANALYSIS;

AIR BRIDGES; CONDUCTOR BACKED COPLANAR WAVEGUIDE; COUPLED SLOTLINE; DISCONTINUITY; FULL WAVE ANALYSIS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; VIA HOLES;

WAVEGUIDES;

EID: 0027149426     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)