Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits

isij international

Volumn 33, Issue 2, 1986, Pages 336-342

  Racz, L M ^a   Szekely, J ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

equilibrium shape; interface; meniscus; solder; surface mount technology; surface tension

Indexed keywords

ASSEMBLY; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; OPTIMIZATION; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; SURFACE TENSION;

EQUILIBRIUM SHAPES; MENISCUS; SOLDER DROPLETS; SURFACE MOUNTED INTEGRATED CIRCUITS;

LIQUID METALS;

EID: 0027148839     PISSN: 09151559     EISSN: None     Source Type: Journal    
DOI: 10.2355/isijinternational.33.336     Document Type: Article

References (8)

1. L. M. Racz, J. Szekely and K. A. Brakke: ISIJ Int., 33 (1993), 328.
2. K. B. Patel: Digital Equipment Corporation, personal communication, (1991-1992).
3. R. C. Weast: CRC Handbook of Chemistry and Physics, 67th ed., CRC Press, Inc., Boca Raton, Florida, (1987), F24.
4. D. A. Porter and K. E. Easterling: Phase Transformations in Metals and Alloys, Van Nostrand Reinhold Co., Ltd., Berkshire, England, (1987), 171.
5. K. A. Brakke: Surface Evolver Mannual, version 1.65, Research Report GCG 31, The Geometry Center, 1300 South Second Street, Minneapolis, MN 55454, (1991).
6. K. A. Brakke: Surface Evolver program, available by anonymous file transfer protocol (ftp) from geom.umn.edu as pub/ evolver.tar.Z.
7. K. A. Brakke: Experimental Mathematics (in press).
8. R. J. Klein Wassink: Soldering in Electronics, Electrochemical Publications, Ltd., Ayr, Scotland, (1989), 644.