Distributed-RLC model for MCM layout

Proceedings 1993 IEEE Multi-Chip Module Conference

Volumn , Issue , 1993, Pages 191-197

  Zhou, D ^a   Tsui, F ^a   Cong, J S ^a   Gao, D S ^a  

^a UNIVERSITY OF NORTH CAROLINA AT CHARLOTTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN; DISTRIBUTED PARAMETER NETWORKS; ELECTRIC NETWORK TOPOLOGY; ELECTRIC WIRING; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; PERFORMANCE;

HIGH SPEED INTERCONNECTION; MCM LAYOUT; MULTICHIP MODULES; VLSI DESIGN;

VLSI CIRCUITS;

EID: 0027142291     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)