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Volumn , Issue , 1993, Pages 92-99
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Flip-chip solder joint interconnections and encapsulants in silicon-on-silicon MCM technology. Thermally induced stresses and mechanical reliability
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC WIRING;
ELECTRONICS PACKAGING;
ENCAPSULATION;
FLIP CHIP DEVICES;
RELIABILITY;
STRESS ANALYSIS;
THERMAL EFFECTS;
ENCAPSULANTS;
FLIP CHIP BONDING;
MECHANICAL RELIABILITY;
MULTICHIP MODULES;
SOLDER JOINT INTERCONNECTIONS;
THERMAL STRESSES;
SOLDERED JOINTS;
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EID: 0027139384
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (15)
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