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Volumn , Issue , 1992, Pages 74-84
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Direct-immersion cooling for high power electronic chips
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Author keywords
[No Author keywords available]
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Indexed keywords
BOILING LIQUIDS;
COOLING;
ELECTRONICS PACKAGING;
HEAT SINKS;
HEAT TRANSFER;
INTEGRATED CIRCUITS;
ELECTRONIC EQUIPMENT COOLING;
HIGH POWER CHIPS;
IMMERSION COOLING;
THERMAL MODELING;
COOLING SYSTEMS;
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EID: 0027101446
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (23)
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References (16)
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