Constitutive characterization of 63/37 Sn/Pb eutectic solder using the Bodner-Partom unified creep-plasticity model

American Society of Mechanical Engineers, EEP

Volumn 2, Issue , 1992, Pages 661-672

  Skipor, Andrew ^a   Harren, Steve ^a   Botsis, John ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CREEP; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTICITY; STRAIN; STRESSES; THERMAL EFFECTS;

63 TIN-37 LEAD EUTECTIC ALLOY SOLDER; BODNER-PARTOM MODEL;

SOLDERING ALLOYS;

EID: 0027100331     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)