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Volumn 3, Issue , 1992, Pages 1229-1232
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Time domain electromagnetic analysis of a via in a multilayer computer chip package
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPUTER AIDED ANALYSIS;
ELECTRIC WIRING;
ELECTROMAGNETIC WAVE REFLECTION;
ELECTRONICS PACKAGING;
EQUIVALENT CIRCUITS;
PRINTED CIRCUIT BOARDS;
TIME DOMAIN ANALYSIS;
COMPUTER CHIPS;
ELECTROMAGNETIC SIMULATION;
INTERCONNECTION CIRCUITS;
MICROWAVE DESIGN;
VIA HOLE MODELING;
COMPUTER CIRCUITS;
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EID: 0027088933
PISSN: 0149645X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (8)
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