Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1992, Pages 1237-1240

  Alessandri, F ^a   Mongiardo, M ^a   Sorrentino, R ^a  

^a Italy ^*

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LOSSES; ELECTROMAGNETIC WAVE SCATTERING; MONOLITHIC INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS;

ELECTROMAGNETIC SIMULATION; FULL WAVE ANALYSIS; MICROSTRIP LINES; VIA HOLE MODELING;

MICROSTRIP DEVICES;

EID: 0027038248     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)