Residual-stress compensation in clamped-clamped micromachined plates

American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC

Volumn 40, Issue , 1992, Pages 23-32

  Ried, R P ^a   Kim, E S ^a   Hong, D M ^a   Muller, R S ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPRESSION TESTING; FINITE ELEMENT METHOD; LAMINATES; MICROMACHINING; MICROPHONES; PIEZOELECTRIC DEVICES; RESIDUAL STRESSES; SIGNAL TO NOISE RATIO; SILICON NITRIDE; TENSILE TESTING; ZINC OXIDE;

COMPRESSIVE RESIDUAL STRESS; RESIDUAL STRESS COMPENSATION; TENSILE RESIDUAL STRESS;

PLATES (STRUCTURAL COMPONENTS);

EID: 0026983524     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)