Phosphosilicate Glass Passivation for Ulsi Cu Metallization

Journal of the Electrochemical Society

Volumn 139, Issue 11, 1992, Pages 3264-3267

  Murakami, K ^a   Kojima, H ^a   Hiraiwa, A ^a   Homma, Y ^a  

^a HITACHI LTD   (Japan)

Author keywords

chemical interdiffusion; copper glass; diffusion barriers; integrated circuit metallisation; metallic thin films; passivation; precipitation

Indexed keywords

ANNEALING; COPPER; DIFFUSION; GLASS; METALLIZING; PASSIVATION; ULSI CIRCUITS;

COPPER METALLIZATION; DIFFUSED COPPER PRECIPITATES; PHOSPHOSILICATE GLASS;

SEMICONDUCTING SILICON;

EID: 0026945901     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2069064     Document Type: Article

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