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1
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84941608741
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Analysis and modeling of interconnections and propagation structures in high speed and high frequency integrated circuits
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V. K. Tripathi and A. Hill, “Analysis and modeling of interconnections and propagation structures in high speed and high frequency integrated circuits,” SPIE Proc., vol. 947, pp. 57–67, 1988.
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SPIE Proc
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Tripathi, V.K.1
Hill, A.2
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2
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0024480103
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Spectral domain computation of characteristic impedances and multiport parameters of multiple coupled microstrip lines
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Jan.
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V. K. Tripathi and H. Lee, “Spectral domain computation of characteristic impedances and multiport parameters of multiple coupled microstrip lines,” IEEE Trans. Microwave Theory Tech., vol. 37, pp. 215–221, Jan. 1989.
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IEEE Trans. Microwave Theory Tech
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Tripathi, V.K.1
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3
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84941603088
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An efficient spectral domain method for the dispersion characteristics of moderately thick microstrip lines
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Mar.
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R. T. Kollipara and V. K. Tripathi, “An efficient spectral domain method for the dispersion characteristics of moderately thick microstrip lines,” IEEE Microwave and Guided Wave Letters, pp. 100–101, Mar. 1992.
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IEEE Microwave and Guided Wave Letters
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Kollipara, R.T.1
Tripathi, V.K.2
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4
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Theory and computer aided analysis of lossless transmission lines
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Coupled lossy transmission line characterization and simulation
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Analysis and modeling of multilevel parallel and crossing interconnection lines
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IEEE Trans. Electron Devices
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Tripathi, V.K.1
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SPICE model for multiple coupled microstrips and other transmission lines
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Tripathi, V.K.1
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Accurate modeling and simulation of parallel interconnection in high-speed integrated circuits
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Gao, D.S.1
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Computer aided analysis and design of uniformly and nonuniform coupled microstrips and other transmission lines
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Proc. European Microwave Conf
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Hayden, L.A.1
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13
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0025792983
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Analysis and modeling of uniformly and nonuniformly coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits
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N. Orhanovic, L. Hayden, and V. K. Tripathi, “Analysis and modeling of uniformly and nonuniformly coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits,” SPIE Int. Conf. Advances in Interconnect and Packaging, vol. 1389, pp. 273–284, 1990.
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SPIE Int. Conf. Advances in Interconnect and Packaging
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Orhanovic, N.1
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Investigation of tapered multiple lines for VLSI circuits
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Mehalic, M.A.1
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Analysis of transients in nonuniform and uniform multiconductor transmission lines
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Palusinski, O.A.1
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The generalized method of characteristics for waveform relaxation analysis of lossy coupled transmission lines
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Chang, F.Y.1
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The time domain response of multiconductor transmission lines
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Nonlinear transient analysis of coupled transmission lines
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Equivalent circuit modeling of losses and dispersion in single and coupled lines for microwave and millimeter wave integrated circuits
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V. K. Tripathi and A. Hill, “Equivalent circuit modeling of losses and dispersion in single and coupled lines for microwave and millimeter wave integrated circuits,” IEEE Trans. Microwave Theory Tech., vol. 36, Feb. 1988.
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Tripathi, V.K.1
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20
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Generalized method of characteristics for time domain simulation of multiconductor lossy lines
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N. Orhanovic, P. Wang, and V. K. Tripathi, “Generalized method of characteristics for time domain simulation of multiconductor lossy lines,” in Proc. IEEE Symp. Circuits and Systems, May 1990.
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21
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84941608742
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Time domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics
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to be published
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N. Orhanovic, P. Wang, and V. K. Tripathi, “Time domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics,” IEEE Trans. Computer-Aided Design, to be published.
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IEEE Trans. Computer-Aided Design
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Orhanovic, N.1
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On the analysis of symmetrical three-line microstrip circuits
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A simple network analog approach for the quasi-static parameters of general lossy anisotropic layered structures
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Quasi-TEM spectral domain technique for multiconductor structures with trapezoidal conductor cross sections
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R. T. Kollipara and V. K. Tripathi, “Quasi-TEM spectral domain technique for multiconductor structures with trapezoidal conductor cross sections,” Microwave and Optical Technologies Lett., vol. 3, pp. 4–6, Jan. 1990.
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A hybrid method for the calculation of the resistance and inductance of transmission lines with arbitrary cross sections
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