Double-level copper interconnections using selective copper CVD

Journal of Electronic Materials

Volumn 21, Issue 10, 1992, Pages 959-964

  Awaya, Nobuyoshi ^a   Arita, Yoshinobu ^a  

^a NTT CORPORATION   (Japan)

Author keywords

chemical vapor deposition; copper; Interconnection; selective copper deposition

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRIC CONNECTORS; REDUCTION; SURFACES;

DOUBLE LEVEL COPPER INTERCONNECTIONS; SELECTIVE DEPOSITION;

COPPER;

EID: 0026932107     PISSN: 03615235     EISSN: 1543186X     Source Type: Journal    
DOI: 10.1007/BF02684203     Document Type: Article

References (12)

1. Reactive Ion Etching of Copper Films in SiCl4and N2Mixture