Time-Domain Characterization of Interconnect Discontinuities in High-Speed Circuits

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 15, Issue 4, 1992, Pages 497-504

  Jong, Jyh Ming ^a   Tripathi, Vijai K ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; DIGITAL INTEGRATED CIRCUITS; ELECTRIC NETWORK ANALYSIS; ELECTROMAGNETIC WAVE PROPAGATION; MICROSTRIP DEVICES; MICROWAVE MEASUREMENT; TIME DOMAIN ANALYSIS; TRANSMISSION LINE THEORY;

HIGH SPEED CIRCUITS; INTERCONNECTS; MULTIPORT DISCONTINUITIES; TIME DOMAIN PROPERTIES; TRANSMISSION LINE ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0026909159     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.159879     Document Type: Article

References (12)

1. A. Gopinath, et al., “Equivalent circuit of some microstrip discontinuities,” IEEE Trans. Microwave Theory Techn. vol. MTT-24, pp. 142–144, 1976.
2. A. Hill, and V. K. Tripathi, “Analysis and modelling of coupled right angle microstrip bend discontinuities,” in IEEE MTT-S Int. Microwave Symp. Dig. 1989, pp. 1143–1146.
3. A. Hill, “Quasi-TEM and Full wave numerical methods for the characterization of microstrip discontinuities,” Ph.D. dissertation, Oregon State Univ., Corvallis, OR, 1989.
4. M. Kischning, R. H. Jensen, and N. H. Koster, “Measurement and computer-aided modelling of microstrip discontinuities by an improved resonator method,” in IEEE MTT-S Microwave Symp. Dig., 1983, pp. 495–497.
5. B. Easter, A. Gopinath, and I. M. Stephenson, “Theoretical and experimental methods for evaluating discontinuities in microstrip,” Radio Electron. Eng. vol. 48, pp. 73–84, 1978.
6. D. H. Smith and R. M. Savara, “High-speed characteristics of multilayer ceramic packages and test fixtures,” in Proc. IEEE GaAs Ic Symp., 1990, pp. 203–206.
7. D. E. Carlton et al., “Accurate measurement of high speed package and interconnect parasitics,” in Proc. IEEE Custom Integrated Circuits Conf., 1988, pp. 23.3.1–7.
8. A. J. Rainai, “Reflection from bends in a printed conductor,” IEEE Trans Comp., Hybrids, Manuf. Technol. vol. 13, pp. 407–413, 1990.
9. H.R. Kaupp, “Characteristics of microstrip transmission lines” IEEE Trans. Electron. Comput., vol. EC-16, pp. 185–193, Apr. 1967.
10. A. Bruckstein and T. Kailath, “An inverse scattering framework for several problems in signal processing,” IEEE ASSP Mag., pp. 6–20, Jan. 1987.
11. S. C. Burkhart and R. B. Wilcox, “Arbitrary pulse shape synthesis via nonuniform transmission lines,” IEEE Trans. Microwave Theory Techn., vol. 38, pp. 1514–1518, Oct. 1990.
12. L. Hayden, J. M. Jong, J. Retting, and V. K. Tripathi, “Measurement and characterization of multiple coupled interconnected lines in hybrid and monolithic integrated circuits,” in Proc. SPIE Int. Symp. on Advances in Interconnects and Packaging, Oct. 1990, pp. 205–214.