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Volumn 21, Issue 8, 1992, Pages 841-862
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Semiconductor wafer bonding. A review of interfacial properties and applications
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
INTERFACES (MATERIALS);
SEMICONDUCTING SILICON;
SILICA;
INTERFACIAL PROPERTIES;
WAFER BONDED STRUCTURES;
WAFER BONDING;
INTEGRATED CIRCUIT MANUFACTURE;
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EID: 0026900505
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (92)
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References (180)
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