Micromechanical velcro

Journal of Microelectromechanical Systems

Volumn 1, Issue 1, 1992, Pages 37-43

  Han, Hongtao ^a   Weiss, Lee E ^a   Reed, Michael L ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES;

MECHANICAL ADHESIVES; MICROMECHANICAL VELCRO;

ELECTROMECHANICAL DEVICES;

EID: 0026837857     PISSN: 10577157     EISSN: 19410158     Source Type: Journal    
DOI: 10.1109/84.128054     Document Type: Article

References (13)

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8. H. Han, L. E. Weiss, and M. L. Reed, “Design micromechanical surface bonding system,” in Proc. Sixth Int. Conf. Solid-State Sensors and Actuators, San Francisco, CA, 1991, pp. 974–977.
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