A Survey of Reliability-Prediction Procedures For Microelectronic Devices

IEEE Transactions on Reliability

Volumn 41, Issue 1, 1992, Pages 2-12

  Bowles, John B ^a  

^a UNIVERSITY OF SOUTH CAROLINA   (United States)

Author keywords

Microelectronic device; Reliability model; Reliability prediction

Indexed keywords

DATA STORAGE, SEMICONDUCTOR - RELIABILITY; FAILURE ANALYSIS; THERMAL EFFECTS;

ARRHENIUS EQUATION; DRAM MEMORY RELIABILITY; FAILURE RATE PREDICTION; INFANT FAILURES; RELIABILITY PREDICTION; VOLTAGE STRESS;

MICROELECTRONICS;

EID: 0026835355     PISSN: 00189529     EISSN: 15581721     Source Type: Journal    
DOI: 10.1109/24.126662     Document Type: Article

References (11)

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2. TR-TSY-000332, Reliability Prediction Procedure For Electronic Equipment, Issue 2, 1988 July; Bellcore.
3. Handbook of Reliability Data for Components Used in Telecommunications Systems, Issue 4, 1987 January; British Telecom.
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