Inductance and Resistance Computations for Three-Dimensional Multiconductor Interconnection Structures

IEEE Transactions on Microwave Theory and Techniques

Volumn 40, Issue 2, 1992, Pages 263-271

  Wu, Ruey Beei ^a   Kuo, Chien Nan ^a   Chang, Kwei K ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTORS;

3-D INTERCONNECTIONS; MULTICONDUCTOR INTERCONNECTIONS;

ELECTRIC NETWORKS;

EID: 0026817527     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.120098     Document Type: Article

References (16)

1. E. E. Davidson and G. A. Katopis, “Package electrical design,” in Microelectronics Packaging Handbook, R. R. Tummala and E. J. Rymaszewski Eds., New York: Van Nostrand Reinhold, 1989, ch. 3.
2. A. E. Ruehli, “Survey of computer-aided electrical analysis of integrated circuit interconnections,” IBM J. Res. Develop., vol. 23, pp. 626–639, Nov. 1979.
3. R. B. Wu and L. L. Wu, “Exploiting structure periodicity and symmetry in capacitance calculations for three-dimensional multiconductor systems,” IEEE Trans. Microwave Theory Tech., vol. 36, pp. 1311–1318, Sept. 1988.
4. R. B. Wu, “Interperiod capacitance calculations for three-dimensional multiconductor systems,” IEEE Trans. Microwave Theory Tech., vol. 36, pp. 1515–1520, Nov. 1988.
5. F. W. Grover, Inductance Calculations: Working Formulas and Tables. New York: Van Nostrand, 1962.
6. A. E. Ruehli, “Inductance calculation in a complex integrated circuit environment,” IBM J. Res. Develop., vol. 16, pp. 470–481, Sept. 1972.
7. P. A. Brenan, N. Raver, and A. E. Ruehli, “Three-dimensional inductance computations with partial element equivalent circuits,” IBM J. Res. Develop., vol. 23, pp. 661–668, Nov. 1979.
8. R. Kamikawai, M. Nishi, K. Nakanishi, and A. Masaki, “Electrical parameter analysis from three-dimensional interconnection geometry,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. CHMT-8, pp. 269–274, June 1985.
9. A. J. Rainal, “Computing inductive noise of chip packages,” AT&T Bell Lab. Tech. J., vol. 63, pp. 177–195, Jan. 1984.
10. J. D. Jackson, Classical Electrodynamics, 2nd ed., New York: Wiley, 1975, sec. 8.1, pp. 335–339.
11. W. T. Weeks, L. L. Wu, M. F. McAllister, and A. Singh, “Resistive and inductive skin effect in rectangular conductors,” IBM. J. Res. Develop., vol. 23, pp. 652–660, Nov. 1979.
12. K. J. Bathe and E. L. Wilson, Numerical Methods in Finite Element Analysis. Englewood Cliffs, NJ: Prentice-Hall, 1976, ch. 7.
13. R. B. Wu and J. C. Yang, “Boundary integral equation formulation of skin effect problems in multiconductor transmission lines,” IEEE Trans. Magn., vol. 25, pp. 3013–3015, July 1989.
14. W. T. Weeks, “Calculation of coefficients of capacitance of multiconductor transmission lines in the presence of a dielectric interface,” IEEE Trans. Microwave Theory, Tech., vol. MTT-18, pp. 35-43, Jan. 1970.
15. B. T. Clark and Y. M. Hill, “IBM multichip multilayer ceramic modules for LSI chips - design for performance and density,” IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. CHMT-3, no. 1, pp. 89–93, Mar. 1980.
16. G. A. Katopis, “Delta-I noise specification for a high-performance computing machine,” Proc. IEEE, vol. 73, no. 9, pp. 1405–1415, Sept. 1985.