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Volumn 40, Issue 5, 1991, Pages 531-536
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Material Failure Mechanisms and Damage Models
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Author keywords
Cause and effect; Failure mechanism
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Indexed keywords
ELECTRONICS PACKAGING - FAILURE;
FATIGUE OF MATERIALS;
FRACTURE MECHANICS;
STRESSES;
SYSTEMS ENGINEERING;
CAUSE AND EFFECT;
CHALLENGE-RESPONSE;
DAMAGE-ENDURANCE;
MATERIAL FAILURE MECHANISMS;
STRESS-STRENGTH;
TOLERANCE-REQUIREMENT;
FAILURE ANALYSIS;
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EID: 0026374740
PISSN: 00189529
EISSN: 15581721
Source Type: Journal
DOI: 10.1109/24.106769 Document Type: Article |
Times cited : (182)
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References (2)
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