Keynote Address Vacuum Microelectronics: What’s New and Exciting

IEEE Transactions on Electron Devices

Volumn 38, Issue 10, 1991, Pages 2276-2283

  Utsumi, Takao ^a  

^a CANON INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE;

FIELD EMITTER ARRAYS; MICROFABRICATION; VACUUM MICROELECTRONICS;

MICROELECTRONICS;

EID: 0026239526     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/16.88510     Document Type: Article

References (20)

1. R. H. Fowler and L. Nordheim, Proc. Roy. Soc. London, ser. A, vol. 119, p. 173, 1928.
2. E. W. Muller, Z. Physik, vol. 102, p. 734, 1936.
3. E. W. Muller, Phys. Rev., vol. 102, p. 618, 1956.
4. E. W. Muller and S. V. Krishnaswamy, Rev. Sci. Instrum., vol. 45, p. 1053, 1974.
5. G. Binning and H. Rohrer, Helvetica Phys. Acta, vol. 55, p. 726, 1982.
6. I. Brodie, J. Appl. Phys., vol. 35, p. 2324, 1964
7. L. W. Swanson and F. M. Charbonnier, in Proc. 2nd. Int. Symp. on Insulation in High Vacuum, 1966.
8. R. P. Little and S. T. Smith, Proc. 2nd. Int. Symp. on Insulation in High Vacuum, 1966
9. T. Utsumi, J. Appl. Phys., vol. 38, p. 2989, 1967.
10. G. E. Vibrans, J. Appl'. Phys., vol. 35, p. 2855, 1964.
11. S. Goto, private communication.
12. H. S. Carslow and J. C. Jarger, Conduction of Heat in Solids, 2nd ed. Oxford, UK: Oxford Sci. Publ., 1959, p. 149.
13. C. A. Spindt, J. Appl. Phys., vol. 39, p. 3504, 1968.
14. H. F. Gray etal., in IEDM Tech. Dig., Dec. 1986, p. 776.
15. S. P. Murarka, J. Vac. Sci. Tech., vol. 17, no. 4, p. 775, 1980 and vol. B2, no. 4, p. 693, 1984.
16. A. K. Sinha., 7. Vac. Sci. Tech., vol. 19, no. 3, p. 778, 1981.
17. O. Nishikawa etal., J. Vac. Sci. Tech., vol. B2, no. 1, p. 21, 1984.
18. T. Tsukamoto, private communication.
19. W. A. Anderson, Vacuum Microelectronics 1989, R. E. Turner, ed.
20. G. J. Campisi and H. F. Gray, in Mat. Res. Soc. Symp. Proc., 1987, vol. 76, p. 67.