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Volumn 138, Issue 10, 1991, Pages 3076-3081

Reactive ion Etching of Silicon Trenches Using SF6/O2 Gas Mixtures

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING - ANISOTROPY; ETCHING - CHEMICAL REACTIONS; MICROSCOPIC EXAMINATION - SCANNING ELECTRON MICROSCOPY; SPECTROSCOPY, AUGER ELECTRON;

EID: 0026238437     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2085371     Document Type: Article
Times cited : (64)

References (22)
  • 19
    • 0022217352 scopus 로고
    • Proceedings of International IEEE V-MIC Conference
    • H. H. Wang, in “Proceedings of International IEEE V-MIC Conference,” p. 335, IEEE (1985).
    • (1985) IEEE , pp. 335
    • Wang, H.H.1
  • 20
    • 84909924113 scopus 로고
    • Plasma Processing
    • G. S. Mathrad, G. C. Schwartz; and G. Smolinsky, Editor, PV 85–1, The Electrochemical Society Softbound Prsceedings Series, Pennington, NJ
    • J. P. McVittie and C. Gonzalez, in “Plasma Processing,” G. S. Mathrad, G. C. Schwartz; and G. Smolinsky, Editor, PV 85–1, p. 552, The Electrochemical Society Softbound Prsceedings Series, Pennington, NJ (1985).
    • (1985) , pp. 552
    • McVittie, J.P.1    Gonzalez, C.2
  • 21
    • 84975379035 scopus 로고
    • VLSI Technology
    • S. M. Sze, Editor, Chap., McGraw Hill, New York
    • R. J. Schutz, in “VLSI Technology,” S. M. Sze, Editor, Chap. 5, McGraw Hill, New York (1989).
    • (1989) , pp. 5
    • Schutz, R.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.