Optimal thermal design of forced conwection heat sinks-analytical

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 3, 1991, Pages 313-321

  Knight, R W ^a   Goodling, J S ^a   Hall, D J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC CIRCUITS - HEAT TRANSFER; HEAT TRANSFER - CONVECTION;

AIR COOLED NARROW CHANNEL HEAT SINKS; FORCED CONVECTION HEAT SINKS; OPTIMAL THERMAL DESIGN;

HEAT SINKS;

EID: 0026220409     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905412     Document Type: Article

References (12)

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3. Goldberg, N., 1984, “Narrow Channel Forced Air Heat Sink,” IEEE Transactions, Components, Hybrids and Manufacturing Technology, Vol. CHMT, No. 1, pp. 154-159.
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5. Incropera, F. P., and DeWitt, D. P., 1990, Fundamentals of Heat and Mass Transfer, Wiley, New York.
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8. Phillips, R. J., 1990, “MicroChannel Heat Sinks,” Chapter 3 of Advances in thermal Modeling of Electronic Components and Systems, Volume 2, Ed. by A. Bar-Cohen and A. D. Kraus, ASME Press, New York, N.Y.
9. Sasaki, S., and Kishimoto, T., 1986, “Optimal Structure for Microgrooved Cooling Fin for High-Power LSI Devices,” Electronics Letters, Vol. 22, No. 25, pp. 1332-1334.
10. Tuckerman, D. B., 1984, “Heat Transfer Microstructures for Integrated Circuits,” §RC Technical Report No. 032, SRC Cooperative Research, Box 12053, Research Triangle Park, NC 27709.
11. Tuckerman, D. B., and Pease, R. F. W., 1981, “High-Performance Heat Sinking for VLSI,” IEEE Electron Device Letters, Vol. EDL-2, No. 5, pp. 126-129.
12. White, F. M., 1974, Viscous Fluid Flow, McGraw-Hill, New York.