Piezoresistive stress sensors for structural analysis of electronic packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 3, 1991, Pages 203-215

  Bittle, D A ^a   Suhling, J C ^a   Beaty, R E ^a   Jaeger, R C ^a   Johnson, R W ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; SENSORS; STRESSES - ANALYSIS; STRUCTURAL ANALYSIS;

ELECTRONIC PACKAGES; PIEZORESISTIVE STRESS SENSORS; STRESS SENSORS;

PIEZOELECTRIC TRANSDUCERS;

EID: 0026219178     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905397     Document Type: Article

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