A Two-Dimensional Process Model for Chemimechanical Polish Planarization

Journal of the Electrochemical Society

Volumn 138, Issue 8, 1991, Pages 2398-2402

  Warnock, J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS, VLSI; POLISHING - MATHEMATICAL MODELS;

CHEMIMECHANICAL POLISH PLANARIZATION;

SEMICONDUCTOR MATERIALS;

EID: 0026204737     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2085984     Document Type: Article

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