Sputtered Ta-Si-N Diffusion Barriers in Cu Metallizations for Si

IEEE Electron Device Letters

Volumn 12, Issue 6, 1991, Pages 321-323

  Ruiz, R P ^b   Pokela, P J ^a   Reid, J S ^a   Chen, J S ^a   Nicolet, Marc A ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC MEASUREMENTS; RADIO TRANSMISSION - APPLICATIONS; SEMICONDUCTING SILICON - APPLICATIONS; TANTALUM AND ALLOYS - APPLICATIONS;

DIFFUSION BARRIERS; N-P JUNCTION DIODES; REACTIVE RF SPUTTERING;

SEMICONDUCTOR DIODES;

EID: 0026168755     PISSN: 07413106     EISSN: 15580563     Source Type: Journal    
DOI: 10.1109/55.82074     Document Type: Article

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