-
1
-
-
0022605808
-
-
‘Comprehensive model for humidity testing correlation’, Proc. IRPS
-
(1986)
, pp. 44-50
-
-
Peck, D.S.1
-
2
-
-
84990682817
-
-
‘The design and evaluation of reliable plastic‐encapsulated semiconductor devices’, Proc. IRPS
-
(1970)
, pp. 81-93
-
-
Peck, D.S.1
-
3
-
-
84990679839
-
-
‘Reliability aspects of plastic encapsulated integrated circuits’, Proc. IRPS
-
(1972)
, pp. 95-99
-
-
Flood, J.L.1
-
4
-
-
84990648827
-
-
‘The IC plastic package: a simple method for predicting package performance’, Proc. IRPS
-
(1972)
, pp. 88-94
-
-
Halleck, M.C.1
-
5
-
-
0015763197
-
-
‘Temperature‐humidity acceleration of metal‐electrolysis failure in semiconductor devices’, Proc. IRPS
-
(1973)
, pp. 146-152
-
-
Peck, D.S.1
Zierdt, C.H.2
-
6
-
-
84990714485
-
-
‘The reliability of plastic microcircuits in moist environments’, Solid State Technology, October
-
(1978)
-
-
Lyckoudes, N.1
-
8
-
-
0020942743
-
-
‘An appraisal of high temperature humidity stress for assessing plastic encapsulated semiconductor components’, Proc. IRPS
-
(1983)
, pp. 73
-
-
Merrett, R.P.1
Bryant, J.P.2
Studd, R.3
-
10
-
-
84990690632
-
-
‘A model for a new failure mechanism—nicrome corrosion in plastic encapsulated PROMs’, Proc. ECC
-
(1983)
, pp. 232-236
-
-
Slota, P.1
Lewisz, P.J.2
-
12
-
-
84990690624
-
-
‘The influence of plastic encapsulants and the passivation layers on the corrosion of thin aluminium films subjected to humidity stress’, Proc. IRPS
-
(1979)
, pp. 102-112
-
-
Slim, S.P.1
Lawson, R.W.2
-
14
-
-
84990687195
-
-
Hirayama Mfg Corp. Tokyo, ‘Electronic components and pressure cooker test’, Publication details unknown.
-
-
-
Hosoya, N.1
-
15
-
-
84990690628
-
-
‘Reliability evaluation of plastic encapsulated ICs using a new pressure cooker test’, Int. Symposium for Testing and Failure Analysis
-
(1981)
, pp. 75-80
-
-
Oawa, K.1
Suzui, J.2
Sano, K.3
-
17
-
-
84990670357
-
-
‘Acceleration factors for temperature‐humidity testing of Al‐metallized semiconductors’, SINTOM, Copenhagen, Denmark
-
(1979)
-
-
Hallberg, Ö.1
-
18
-
-
84990670356
-
-
‘Evaluation of a parasitic charge‐spreading transistor as a moisture sensor’, RADC/NBS International Workshop, Moisture Measurement and Control for Microelectronics, (IV), NBSIR 87‐3588, pp.
-
-
-
Hultén, K.1
Hallberg, Ö.2
-
19
-
-
84990687224
-
-
‘Accelerated stress tests of plastic packaged devices’, in Reliability Technology—Theory and Application, Elsevier Science Publishers B. V. (Holland)
-
(1986)
-
-
Brambilla, P.1
Fantini, F.2
-
20
-
-
84990690615
-
-
‘Moisture‐resistant test using unsaturated pressure cooker equipment’, ISTFA
-
(1986)
, pp. 189-194
-
-
Wada, T.1
-
21
-
-
84990690638
-
-
‘Temperature‐humidity‐bias tests with aluminium tripple track chips at 130 Deg.C at 85% RH’, International Electronics Packaging Conf., San Diego, CA
-
(1986)
-
-
Yerman, A.J.1
Burgess, J.F.2
-
22
-
-
84990686340
-
-
‘Metallization corrosion in silicon devices by moisture‐induced electrolysis’, Proc. IRPS
-
(1974)
, pp. 168-191
-
-
Koelmans, H.1
-
23
-
-
84990686346
-
-
‘Moisture uptake and release by plastic moulding compounds—its relationship to system life and failure mode’, Proc. IRPS
-
(1980)
, pp. 293-300
-
-
Dycus, D.W.1
-
25
-
-
0022221312
-
-
‘A paradoxial relationship between width‐spacing of aluminium electrodes and aluminium corrosion’, Proc. IRPS
-
(1985)
, pp. 159-163
-
-
Wada, T.1
Higuchi, H.2
Ajiki, T.3
-
26
-
-
0021415720
-
A review of the status of plastic encapsulated semiconductor component reliability
-
(1982)
Br. Telecom Tech. J.
, vol.2
, Issue.2
, pp. 95-111
-
-
Lawson, R.W.1
-
28
-
-
0023245880
-
-
‘Chlorine content in and life of plastic encapsulated micro‐circuits’, IEEE Proc. ECC.
-
(1987)
, pp. 491-499
-
-
Gustafsson, K.1
Lindborg, U.2
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