Compositional changes during magnetron sputtering of alloys

Thin Solid Films

Volumn 199, Issue 1, 1991, Pages 59-69

  Rossnagel, S M ^a   Yang, I ^b   Cuomo, J J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMS; PROBABILITY; TITANIUM TUNGSTEN ALLOYS;

MAGNETRON SPUTTERING;

ALUMINUM COPPER ALLOYS;

EID: 0026137889     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(91)90052-Y     Document Type: Article

References (18)

1. Some Calculations of the Thickness Distribution of Films Deposited from Large Area Sputtering Sources
2. Reactive deposition of low loss Al2O3 optical waveguides by modified dc planar magnetron sputtering
3. Step coverage simulation and measurement in a dc planar magnetron sputtering system
4. Applications of Monte Carlo simulation in the analysis of a sputter-deposition process
5. Deposition and redeposition in magnetrons
6. Gas density reduction effects in magnetrons
7. Internal stresses in amorphous silicon films depositied by cylindrical magnetron sputtering using Ne, Ar, Kr, Xe, and Ar+H2
8. Energetic particle bombardment of films during magnetron sputtering