A Closed-Form Spatial Green's Function for the Thick Microstrip Substrate

IEEE Transactions on Microwave Theory and Techniques

Volumn 39, Issue 3, 1991, Pages 588-592

  Fang, D G ^b   Yang, J J ^a   Howard, G E ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

^b NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELDS; MATHEMATICAL TECHNIQUES - BOUNDARY VALUE PROBLEMS; SURFACE WAVES;

CLOSED-FORM GREEN'S FUNCTION; MICROSTRIP SUBSTRATES; SOMMERFELD INTEGRALS;

MICROSTRIP DEVICES;

EID: 0026116366     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.75309     Document Type: Article

References (9)

1. Y. L. Chow, “An approximate dynamic spatial Green’s function in three dimensions for finite length microstrip lines,” IEEE Trans. Microwave Theory Tech., vol. MTT-28, pp. 393–397, 1980.
2. J. R. Mosig and F. E. Gardiol, “A dynamical radiation model for microstrip structures,” in Advances in Electronics and Electron Physics, vol. 59. London: Academic Press, 1982, pp. 139–239.
3. P. B. Katehi and N. G. Alexopolous, “Real axis integration of Sommerfeld integrals with application to printed circuit antennas,” J. Math. Phys., vol. 24, pp. 527–533, 1983.
4. E. Alanen and I. V. Lindell, “Exact image method for field calculation in horizontally layered medium above a conducting ground plane,” Proc. Inst. Elec. Eng., vol. 133, pt. H, pp. 297–304, 1986.
5. D. G. Fang, J. J. Yang, and G. Y. Delisle, “Discrete image theory for horizontal electric dipoles in a multilayered medium,” Proc. Inst. Elec. Eng., vol. 135, pt. H, pp. 297–303, 1988.
6. J. A. Stratton, Electromagnetic Theory. New York: McGraw-Hill, 1941, p. 576, eq. (17).
7. J. Dai and Y. L. Chow, “A reduced model of a series of image charges for study MMIC’s,” in Proc. Second Asia-Pacific Microwave Conf. (Beijing, China), Oct. 26–28, 1988.
8. J. Duncan, The Elements of Complex Analysis. New York: Wiley, 1968.
9. R. W. Hamming, Numerical Methods for Scientists and Engineers. New York: Dover, 1973, pp. 620–622.