Analysis of Homogenizing Process of Alloying Elements on Transient Liquid Insert Metal Diffusion Bonding: Study on Transient Liquid Insert Metal Diffusion Bonding of Ni-base Superalloys, (Part 4)

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Volumn 9, Issue 1, 1991, Pages 55-62

  Nakao, Yoshikuni ^a   Nishimoto, Kazutoshi ^a   Shinozaki, Kenji ^a   Yun, Kan Chung ^b   Shigeta, Haruki ^c  

^a OSAKA UNIVERSITY   (Japan)

^b Pusan National University   (South Korea)

^c JFE STEEL CORPORATION   (Japan)

Author keywords

Aluminum; Diffusion; Homogenizing process; Ni base superalloy; Titanium; TLP bonding

Indexed keywords

DIFFUSION; NICKEL CHROMIUM BORON ALLOYS; NICKEL COBALT CHROMIUM ALLOYS--BONDING; SUPERALLOYS--BONDING;

ALLOY IN939; ALLOY INCONEL 713C; ALLOY MAR-M-007; ALLOY MM007; TRANSIENT LIQUID INSERT METAL DIFFUSION BONDING;

NICKEL AND ALLOYS;

EID: 0026105008     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.9.55     Document Type: Article

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