X-ray laminography analysis of ultra-fine-pitch solder connections on ultrathin boards

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 1464, Issue , 1991, Pages 484-497

  Adams, John A ^a  

^a USA ^*

Author keywords

[No Author keywords available]

Indexed keywords

SOLDERING - X-RAY ANALYSIS;

FINE PITCH TECHNOLOGY; INTERCONNECTS; SOLDER CONNECTIONS; ULTRATHIN BOARDS; X-RAY LAMINOGRAPHY;

PRINTED CIRCUITS;

EID: 0025794942     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.44460     Document Type: Conference Paper

References (13)