Layer Assignment for Multichip Modules

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 9, Issue 12, 1990, Pages 1272-1277

  Ho, Jan Ming ^a   Sarrafzadeh, Majid ^a,b   Vijayan, Gopalakrishnan ^a   Wong, C K ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b NORTHWESTERN UNIVERSITY   (United States)

Author keywords

approximation algorithms; Electronic packaging; layer assignment; multichip modules (MCM); multiterminal nets; NP complete ness; VLSI layout

Indexed keywords

INTEGRATED CIRCUITS--ELECTRONICS PACKAGING; MATHEMATICAL TECHNIQUES--ALGORITHMS;

APPROXIMATION ALGORITHMS; LAYER ASSIGNMENT; MULTICHIP MODULES; MULTITERMINAL NETS; VLSI DESIGN;

INTEGRATED CIRCUITS, VLSI;

EID: 0025664148     PISSN: 02780070     EISSN: 19374151     Source Type: Journal    
DOI: 10.1109/43.62772     Document Type: Article

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