Measurement of three dimensional stress and modeling of stress induced migration failure in aluminum interconnects

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1990, Pages 221-229

  Tezaki, Atsumu ^a   Mineta, Takashi ^a   Egawa, Hidemitsu ^a   Noguchi, Tatsuo ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS--STRESSES; FAILURE ANALYSIS;

ALUMINUM INTERCONNECTS; FAILURE RATE; KINETIC FAILURE MODEL; STRESS INDUCED MIGRATION; STRESS RELAXATION; THREE DIMENSIONAL STRESS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0025646298     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1990.363525     Document Type: Conference Paper

References (28)