Silicon Interconnect—A Critical Factor in Device Thermal Management

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 4, 1990, Pages 946-952

  Witzman, Sorin ^a   Smith, Kevin ^a   Metelski, George ^a  

^a NORTEL NETWORKS   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING--DEGRADATION; MICROELECTRONICS--THERMAL EFFECTS; SOLID STATE DEVICES--FAILURE;

ELECTROTHERMAL STRESS; SILICON DEVICES; SILICON INTERCONNECT;

INTEGRATED CIRCUITS;

EID: 0025550912     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.62567     Document Type: Article

References (12)

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