Mechanism of electro-migration in ceramic package induced by chip-coating polyimide

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 1990, Pages 894-899

  Kohara, Masanobu ^a   Mashiko, Youji ^a   Nakazaki, Koichi ^a   Nunoshita, Masahiro ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS, LSI; POLYIMIDES;

CERAMIC PACKAGES; ELECTROMIGRATION; LSI CHIPS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0025547095     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)