Stress relaxation of continuous film and narrow line metallizations of aluminum on silicon substrates

Scripta Metallurgica et Materiala

Volumn 24, Issue 12, 1990, Pages 2297-2302

  Korhonen, M A ^a   Paszkiet, C A ^a   Black, R D ^a   Li, Che Yu ^a  

^a Department of Obstetrics Gynecology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILMS--ALUMINUM; HEAT TREATMENT--ANNEALING; STRESSES;

STRESS RELAXATION;

SEMICONDUCTING SILICON;

EID: 0025545575     PISSN: 0956716X     EISSN: None     Source Type: Journal    
DOI: 10.1016/0956-716X(90)90082-R     Document Type: Article

References (15)

1. Residual stress analysis of Al alloy thin film by X-ray diffraction as a function of film thickness
2. X-ray stress studies of passivated and unpassivated thin aluminum line metallizations
3. X-ray diffraction analysis of strains and stresses in thin films
4. Finite element calcullations of thermal stresses in passivated and unpassivated lines bonded to substrates