Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 1990, Pages 418-425

  Riemer, Dietrich E ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE--SOLDERING; SOLDERING--MECHANICAL PROPERTIES;

SOLDER JOINTS;

ELECTRONICS PACKAGING;

EID: 0025539387     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)