Temperature Dependence of Thermal Expansion of Ceramics and Metals for Electronic Packages

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 13, Issue 4, 1990, Pages 743-750

  Hall, Peter M ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS--EXPANSION; METALS AND ALLOYS--EXPANSION; STRAIN GAGES; STRAIN--MEASUREMENTS;

ELECTRONIC PACKAGES; STRAIN GAGE MEASUREMENTS; TEMPERATURE DEPENDENCE; THERMAL EXPANSION;

MICROELECTRONICS;

EID: 0025531358     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.62588     Document Type: Article

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