1/fα Noise and Fabrication Variations of TiW/Al VLSI Interconnections

IEEE Electron Device Letters

Volumn 11, Issue 11, 1990, Pages 523-525

  Cottle, James G ^a   Klonaris, N S ^a   Bordelon, Mark ^b  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

^b INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SEMICONDUCTING FILMS--THIN FILMS; SEMICONDUCTOR DEVICES;

THIN-FILM INTERCONNECTIONS;

INTEGRATED CIRCUITS, VLSI;

EID: 0025519320     PISSN: 07413106     EISSN: 15580563     Source Type: Journal    
DOI: 10.1109/55.63020     Document Type: Article

References (8)

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