Are you ready for next-generation dynamic RAM chips?: Chip designers must evaluate tradeoffs such as stacked versus trench capacitors and consider the need to minimize power consumption

IEEE Spectrum

Volumn 27, Issue 11, 1990, Pages 110-112

  Masuoka, Fujio ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE, DIGITAL - RANDOM ACCESS;

6Y-MB DRAMS; DYNAMIC RAM CHIPS;

MICROPROCESSOR CHIPS;

EID: 0025510694     PISSN: 00189235     EISSN: None     Source Type: Journal    
DOI: 10.1109/6.62227     Document Type: Article

References (0)